Underfills are materials made of epoxy that are used in different electronic assemblies to handle the gaps that exist between components and on the PCBs. Applying an underfill protects the components from vibration, thermal cycling, drop, and shock.
Make money doing what you love. No fees on donations! Start a free Ko-fi page
Help BGA underfill Epoxy adhesive by sharing this page anywhere!
Boost BGA underfill Epoxy adhesive's page by gifting a Ko-fi Gold Membership with a one-time payment.
{{ tier.Description }}
We sent a verification code to: {{ emailSignup.email }} Check your Gmail inbox.
If you don't get the email after a few minutes, tap below to resend.